- ACI - metal, alloy sputtering materials
- Advanced Radiation - UV lamps
- BenQ Material - various Back-sheet materials
- BESA - special alloy, tungsten carbide blade
- Bruker EAS / Bruker HST - super conductor wire, S/C magnets
- CCT - compound semiconductor wafer
- Cerac - evaporating, sputtering materials, reagent
- Chaozhou Three - Chip resistor
Alumina Substrate
- Cheil - specific chemicals - a Samsung company
- Chimei - Phosphor Powder
- Chinup - solar module manufacturing equipment
- Corn Products - dextrose, starches
- Daido - Ni/Fe alloy, Alloy 42 strip
- E&R - Automated Laser Equipment
- Finetech - special adhesive tapes
- Formosa Plastics - EVA film
- GEE - LFP for solar cell
- GIANT-TEK - Rapid temperature
process equipment
- GIGA - Ag/Al Paste for Solar Cell
- Good Fellow - various reagents
- Irico Glass - solar module glass
- Isabellenhutte - resistance wires, precision resistors
- KCC - Silicone Adhesive for LED
- Lucas - brazing materials-a Handy&Harman company
- Martin Marietta - magnesium oxide, hydroxide
- Metal crystals & Oxides - metal, alloy, crystals
- MMG (TT group) - ferrite cores
- Nanomse - Ag Paste for Touch Panel
- NEG - alumina silicate glass
- Nilaco - various reagents
- Optorun - sputtering equipments
- Orient Nanko - SiC powder
- Osprey - stainless steel powder
- Panaxem - EMI Paint, gasket
- PPM - high purity metals
- Rasa - high purity metals, compounds
- RD Mathis - evaporating parts
- Recapture - Refining metals
- Samyang - (waxy) corn starch, dextrose
anhydrous
- ShenMao - PV Ribbon
- Sinoma - crucible for polycrystal si-ingot
- Sintez - special metal powders
- Si-Tech - single crystal substrates
- Sumitomo - various sputtering target
- Technic - Ag,Pt,Pd power
- The Ingredients Co. – various crops starch
- Toshima - evaporating, sputtering materials
- Ultra Chip - touch panel IC
- Umicore - Cobalt powder
- Vacuumschmelze – magnetic materials ; NiFe,CoFe alloy ; amorphous components
- Wall Colmonoy - plasma spray, brazing material
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