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Agents for |
- ACI - metal, alloy sputtering materials
- Advanced Radiation - UV lamps
- Akcome - solar module aluminum frame
- Arima - LED Chip
- BenQ Material - various Back-sheet materials
- BESA - special alloy, tungsten carbide blade
- Bruker EAS / Bruker HST - super conductor wire, S/C magnets
- CCT - compound semiconductor wafer
- Cerac -evaporating, sputtering materials, reagent
- Cheil - specific chemicals - a samsung company
- Chimei - Phosphor Powder
- Chinup - solar module manufacturing equipment
- Corn Products - dextrose, starches
- CP Films - conductive film, conductive glass
- Daido - Ni/Fe alloy, Alloy 42 strip
- Finetech - special adhesive tapes
- Formosa Plastics - EVA film
- GIGA - Ag/Al Paste for Solar Cell
- Good Fellow - various reagents
- Hehe Glass - solar module glass
- Isabellenhutte - resistance wires, precision resistors
- KCC - Silicone Adhesive for LED
- Lucas - brazing materials-a Handy&Harman company
- Martin Marietta - magnesium oxide, hydroxide
- Metal crystals & Oxides - metal, alloy, crystals
- MMG (TT group) - ferrite cores
- Nanomse - Ag Paste for Touch Panel
- NEG - alumina silicate glass
- Nilaco - various reagents
- Optorun - sputtering equipments
- Osprey - professional SUS powder
- Panaxem - EMI Paint
- PPM - high purity metals
- Rasa - high purity metals, compounds
- RD Mathis - evaporating parts
- Recapture - Refining metals
- Samyang - corn starch, waxy corn starch
- SDI - Lead-frame for LED
- ShenMao - PV Ribbon
- Sinoma - crucible for polycrystal si-ingot
- Sintez - special metal powders
- Si-Tech - single crystal substrates
- Sumitomo - sputtering target for TCO & PV
- Technic - Ag,Pt,Pd power
- The Ingredients Co. – various crops starch
- Toshima - evaporating, sputtering materials
- Ultra Chip - touch panel IC
- Umicore - Cobalt powder
- Vacuumschmelze – magnetic materials ; NiFe,CoFe alloy ; amorphous components
- Wall Colmonoy - plasma spray, brazing material
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