科技材料事業群

►Manufacturing equipment (wet process/dry process), Testing equipment for Semiconductor /IC substrate/Circuit Board/Copper Foil Substrate

Wet process: Gantry Plating, Chemical Plating, Desmear, ENIG, VCP, DES, Coater, IJP (Ink Jet Printer), etc.

Dry process: Oven, Lamination, Sputtering, CCL cutting.

Inspection Equipment: AOI, AVI, Non-Contact 3D Surface Microscope, etc.

►Materials and chemicals for semiconductors/IC substrates/circuit boards/copper foil substrates, etc.

Main materials: Copper foil, CCL, FCCL, CCL Dummy (Coating Board, Process Capability Board), etc.

Ink: Text Ink, Solder Mask Ink, etc.

Chemicals: Nickel-free ENIG, SAP & m-SAP process special chemicals.

Lamination: Buffer Material, Press Stainless Plate.

Drilling: Drill Needle, Milling Cutter, Pad

other

►Hot Press Stainless Plate for CCL, Resin

Hot Press Stainless Plate: Mirror steel plate (SUS630, etc.), Upper and Lower Cover Plates (Hardox450), etc.

Resin: Main Agent, Additives (low Dk/Df, improve adhesion to copper, adjust CTE, etc.).

►Blanks for photomask

We provide Soda Lime and Quartz blanks., with sizes ranging from 4 inches to nearly 1000mm. We can customize the chrome film (Cr) thickness, photoresist thickness, optical density (OD), etc. according to customer needs.
Blank size we provide is as below,(underlined is the frequent-shipped size):

1. 4009, 5009, 9012
2. 430mm*430mm, 450mm*550mm
3. 14inch*14inch, 14inch*17inch, 17inch*17inch
4. 700mm*800mm

【Downloads：Please contact our person in charge】

►Photomask

We provide Soda Lime and Quartz blanks., with sizes ranging from 4 inches to nearly 1000mm. We can customize the chrome film (Cr) thickness, photoresist thickness, optical density (OD), etc. according to customer needs.
The photomask size we provide is as below, (underlined is the frequent-shipped size) :

1.450mm*550mm
2.700mm*800mm
3.800mm*960mm
4.813mm*1092mm
5.813mm*1379mm
6.914mm*1117mm

Application field ：
1.Fine Metal Mask (FMM) for OLED
2.Metal Mesh
3.Others

【Downloads：Please contact our person in charge】

►	FPC flexible circuit board materials - conductive adhesive, EMI shielding film, non-conductive adhesive

The main advantage of TOYO products lies in its long-term experience in the FPC field, especially in terms of conductivity, shielding, heat resistance, reinforcement, etc., which have unparalleled performance advantages in the industry. The product has the advantages of high reliability, adaptability to high step difference, excellent conductivity (Conductive adhesive), high adhesion, etc. It is the first choice for steel sheet bonding, electromagnetic wave shielding and circuit board bonding. Gredmann has a strong and stable physique, owns its own warehouse, and has the ability to communicate directly with Japanese original manufacturers. It is the best partner for customers in the rapidly changing electronics industry.

Applications:
1. FPC flexible circuit board
2. Rigid-flex board
3. Camera module
4. Display module
5. Antenna
6. 5G high frequency application
7. Others

【Downloads: For relevant downloads, please contact the responsible person】

►Power Management IC (PMIC)

1. Single Inductor Multiple Output (SIMO): Compared to traditional multi-circuit, multi-inductor output ICs, SIMO significantly reduces BOM cost (e.g., high-cost automotive inductors) and simplifies the BOM list. It also helps mitigate inductor shortages and delivery lead time issues.

2. Compact Size: Reduces PCB space usage by approximately 10–20%.

3. Power Efficiency: In wearable devices and standby-mode applications, our PMIC delivers exceptional performance under both light and heavy loads, ensuring extended battery life.

Applications:
1. Smart Locks & Security Devices: Smart locks, doorbells, peephole cameras, 360° meeting cameras, automotive cameras, DVRs, Driver Monitoring Systems (DMS), surround view cameras, and AVM (Around View Monitor) systems.

2. High Voltage Input: A 17V input, 6-channel SIMO power management IC designed for radar and camera modules.

3. Low Voltage Input: A single inductor supporting four DC/DC converters and one LDO, with an ultra-compact WLCSP 1.68 × 1.68mm package, ideal for small and precision-driven products.

4. Wearable Device Displays: The smallest power management IC on the market for smartwatches and fitness bands. Utilizing SIBO technology, it generates two positive and one negative output voltage using just one inductor and fewer capacitors. Its dynamic voltage adjustment significantly reduces power consumption for displays. For smartphones, it features two boost converters and an inverting buck-boost converter to provide two positive and one negative voltage output.

【Downloads：For relevant downloads, please contact the responsible person】

►Toughened Heat-Resistant Resin

Product Features:
1. Low Dk/Df Performance: Enables reduction and adjustment of Dk and Df values. (Dk: ~2.5, Df: 0.002–0.0035)

2.Excellent Heat Resistance: Td₅% at 400°C and outstanding hydrolysis resistance (maintains molecular weight stability after 500 hours at 85°C, 85% RH).

3. Enhanced Ductility: Offers 200%–300% elongation, reducing stress and minimizing warpage, especially for camera module applications.

4. Versatile Form Options: Available as powder (solvent-free) and solvent-based resin, including transparent resin and photoresist resin options.

【Downloads：For relevant downloads, please contact the responsible person】

►Infrared Transmission (IR Pass) & Infrared Absorption (IR Cut) Materials

We provide IR Pass and IR Cut materials for various applications, including iris recognition, under-display fingerprint recognition (FOD, Fingerprint on Display), noise reduction, automotive applications, LiDAR (Light Detection and Ranging), Time of Flight (TOF) sensors, and heat ray absorption for thermal insulation.

Product Features:
1. Utilizes coating instead of adding a filter, achieving a thinner module design.
2. Adjustable wavelength.
3. Ultra-thin thickness, reaching up to 1μm
4. High transmittance.
5. Available in resist ink, dispersion, and master batch forms.

【Downloads：For relevant downloads, please contact the responsible person】

►Light-Shielding Ink

Product Features:
Applied to the outer edge of lenses, lens barrels, and around sensors, this ink has a wide range of applications. It provides excellent light-blocking performance and serves as an innovative solution for lens module manufacturers to reduce stray light and ghosting interference.

Product Features:
1. The coating has an extremely low L-value (L-value: 17), achieving deep black coloration, effectively absorbing light, and reducing light reflectance (60° Gloss = 0.2%).

2. Available in various models, including low-reflection, insulating, low-charge, and halogen-free options.

【Downloads：For relevant downloads, please contact the responsible person】