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Passive Components Material Division
Passive components material division offers the material of variable passive components. All the specifications could be customized by customer’s produce index.
Silver paste, low temperature silver paste and Cu/Ni paste electrode glass powder for producing electric capacitor (MLCC).
Silver paste, glass paste, overcoat Ink, Cu/Ni/Mn paste, and target for producing thick-film chip resistor.
Mn/Cu, Cu/Ni, Cu/Ni/Mn, Mn/Cu/Sn alloys for making alloy chip resistor
Silver paste, low temperature silver paste, overcoat ink, and magnetic conductive adhesive for producing inductance
Glass powder and silver paste for producing LTCC
Glass powder for producing silver/ aluminum paste in solar energy industries
Silver paste and epoxy resin adhesive for touchscreen/ semiconductor package
Designing and developing of silver paste, epoxy paste for all kinds of electronic component.

Import
Materials used in Optoelectronic, Semiconductor, Electronic, Electric-Engineering and Solar;Import and Triangular Trade of Metal / Alloy and Inorganic materials

Global Site
Taiwan, Hong Kong, China, Beijing, Shanghai, Shenzhen, Well-Being, Gredium Material

Factory
Fine Chemical, Innotek, PCB, Gredium Indium
Gredmann Group Copyright (C)1996-2023 Gredmann Group. All rights reserved.
Tel:886-2-2719 3456 (20 Lines) Fax:886-2-2716 5500, 886-2-2716 5522, 886-2-2716 5700
Add:105 9F, No. 170, Sec.3, Min Chuan E. Road, Songshan Dist., Taipei City