►Passive Components Material Division
Passive components material division offers the material of variable passive components. All the specifications could be customized by customer’s produce index.
● Silver paste, low temperature silver paste and Cu/Ni paste electrode glass powder for producing electric capacitor (MLCC).
● Silver paste, glass paste, overcoat Ink, Cu/Ni/Mn paste, and target for producing thick-film chip resistor.
● Mn/Cu, Cu/Ni, Cu/Ni/Mn, Mn/Cu/Sn alloys for making alloy chip resistor
● Silver paste, low temperature silver paste, overcoat ink, and magnetic conductive adhesive for producing inductance
● Glass powder and silver paste for producing LTCC
● Glass powder for producing silver/ aluminum paste in solar energy industries
● Silver paste and epoxy resin adhesive for touchscreen/ semiconductor package
● Designing and developing of silver paste, epoxy paste for all kinds of electronic component.
● Silver paste, low temperature silver paste and Cu/Ni paste electrode glass powder for producing electric capacitor (MLCC).
● Silver paste, glass paste, overcoat Ink, Cu/Ni/Mn paste, and target for producing thick-film chip resistor.
● Mn/Cu, Cu/Ni, Cu/Ni/Mn, Mn/Cu/Sn alloys for making alloy chip resistor
● Silver paste, low temperature silver paste, overcoat ink, and magnetic conductive adhesive for producing inductance
● Glass powder and silver paste for producing LTCC
● Glass powder for producing silver/ aluminum paste in solar energy industries
● Silver paste and epoxy resin adhesive for touchscreen/ semiconductor package
● Designing and developing of silver paste, epoxy paste for all kinds of electronic component.
Willie Yang
【TEL】
(02)2719-3456 Ext 9331
【EMAIL】
Willie@gredmann.com
